Ryzen AI 9 HX 170 vs Celeron M ULV 723
Primary details
Comparing Celeron M ULV 723 and Ryzen AI 9 HX 170 processor market type (desktop or notebook), architecture, sales start time and price.
| Place in the ranking | not rated | not rated |
| Place by popularity | not in top-100 | not in top-100 |
| Market segment | Laptop | Laptop |
| Series | no data | AMD Strix Point (Zen 5/5c, Ryzen AI 3/5/7/9) |
| Architecture codename | no data | Strix Point-HX (Zen 5) (2024) |
| Release date | 1 July 2008 (16 years ago) | 4 June 2024 (less than a year ago) |
Detailed specifications
Celeron M ULV 723 and Ryzen AI 9 HX 170 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.
| Physical cores | no data | 12 (Dodeca-Core) |
| Threads | no data | 24 |
| Base clock speed | 1.2 GHz | no data |
| Boost clock speed | no data | 5.1 GHz |
| L3 cache | 1 MB L2 Cache | 36 MB |
| Chip lithography | 45 nm | 3 nm |
| Maximum core temperature | 105 °C | no data |
| 64 bit support | + | + |
| Windows 11 compatibility | - | no data |
| VID voltage range | 1.05V-1.15V | no data |
Compatibility
Information on Celeron M ULV 723 and Ryzen AI 9 HX 170 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.
| Socket | BGA956 | no data |
| Power consumption (TDP) | 10 Watt | 55 Watt |
Technologies and extensions
Technological solutions and additional instructions supported by Celeron M ULV 723 and Ryzen AI 9 HX 170. You'll probably need this information if you require some particular technology.
| Instruction set extensions | no data | XDNA 2 NPU |
| Enhanced SpeedStep (EIST) | - | no data |
| Turbo Boost Technology | - | no data |
| Hyper-Threading Technology | - | no data |
| Demand Based Switching | - | no data |
| FSB parity | - | no data |
Security technologies
Celeron M ULV 723 and Ryzen AI 9 HX 170 technologies aimed at improving security, for example, by protecting against hacks.
| TXT | - | no data |
| EDB | + | no data |
Virtualization technologies
Virtual machine speed-up technologies supported by Celeron M ULV 723 and Ryzen AI 9 HX 170 are enumerated here.
| VT-x | - | no data |
Pros & cons summary
| Recency | 1 July 2008 | 4 June 2024 |
| Chip lithography | 45 nm | 3 nm |
| Power consumption (TDP) | 10 Watt | 55 Watt |
Celeron M ULV 723 has 450% lower power consumption.
Ryzen AI 9 HX 170, on the other hand, has an age advantage of 15 years, and a 1400% more advanced lithography process.
We couldn't decide between Celeron M ULV 723 and Ryzen AI 9 HX 170. We've got no test results to judge.
Should you still have questions on choice between Celeron M ULV 723 and Ryzen AI 9 HX 170, ask them in Comments section, and we shall answer.
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