Ryzen AI 9 HX 170 vs Celeron B810

Primary details

Comparing Celeron B810 and Ryzen AI 9 HX 170 processor market type (desktop or notebook), architecture, sales start time and price.

Place in the ranking	2890	not rated
Place by popularity	not in top-100	not in top-100
Market segment	Laptop	Laptop
Series	Intel Celeron	AMD Strix Point (Zen 5/5c, Ryzen AI 3/5/7/9)
Power efficiency	1.32	no data
Architecture codename	Sandy Bridge (2011−2013)	Strix Point-HX (Zen 5) (2024)
Release date	1 March 2011 (13 years ago)	4 June 2024 (less than a year ago)
Launch price (MSRP)	$86	no data

Detailed specifications

Celeron B810 and Ryzen AI 9 HX 170 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.

Physical cores	2 (Dual-core)	12 (Dodeca-Core)
Threads	2	24
Base clock speed	1.6 GHz	no data
Boost clock speed	1.6 GHz	5.1 GHz
Bus type	DMI 2.0	no data
Bus rate	4 × 5 GT/s	no data
Multiplier	16	no data
L1 cache	64K (per core)	no data
L2 cache	256K (per core)	no data
L3 cache	2 MB (shared)	36 MB
Chip lithography	32 nm	3 nm
Die size	131 mm2	no data
Maximum core temperature	100 °C	no data
Number of transistors	504 million	no data
64 bit support	+	+
Windows 11 compatibility	-	no data

Compatibility

Information on Celeron B810 and Ryzen AI 9 HX 170 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

Number of CPUs in a configuration	1 (Uniprocessor)	no data
Socket	PGA988	no data
Power consumption (TDP)	35 Watt	55 Watt

Technologies and extensions

Technological solutions and additional instructions supported by Celeron B810 and Ryzen AI 9 HX 170. You'll probably need this information if you require some particular technology.

Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2	XDNA 2 NPU
FMA	+	-
Enhanced SpeedStep (EIST)	+	no data
My WiFi	-	no data
Turbo Boost Technology	-	no data
Hyper-Threading Technology	-	no data
Idle States	+	no data
Thermal Monitoring	+	-
Flex Memory Access	+	no data
Demand Based Switching	-	no data
FDI	+	no data
Fast Memory Access	+	no data

Security technologies

Celeron B810 and Ryzen AI 9 HX 170 technologies aimed at improving security, for example, by protecting against hacks.

TXT	-	no data
EDB	+	no data
Anti-Theft	-	no data

Virtualization technologies

Virtual machine speed-up technologies supported by Celeron B810 and Ryzen AI 9 HX 170 are enumerated here.

VT-d	-	no data
VT-x	+	no data

Memory specs

Types, maximum amount and channel quantity of RAM supported by Celeron B810 and Ryzen AI 9 HX 170. Depending on the motherboard, higher memory frequencies may be supported.

Supported memory types	DDR3	no data
Maximum memory size	16.6 GB	no data
Max memory channels	2	no data
Maximum memory bandwidth	21.335 GB/s	no data

Graphics specifications

General parameters of integrated GPUs, if any.

Integrated graphics card	Intel HD Graphics for 2nd Generation Intel Processors	no data
Graphics max frequency	950 MHz	no data

Graphics interfaces

Available interfaces and connections of Celeron B810 and Ryzen AI 9 HX 170 integrated GPUs.

Number of displays supported	2	no data
eDP	+	no data
DisplayPort	+	-
HDMI	+	-
SDVO	+	no data
CRT	+	no data

Peripherals

Specifications and connection of peripherals supported by Celeron B810 and Ryzen AI 9 HX 170.

PCIe version	2.0	no data
PCI Express lanes	16	no data

Pros & cons summary

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Recency	1 March 2011	4 June 2024
Physical cores	2	12
Threads	2	24
Chip lithography	32 nm	3 nm
Power consumption (TDP)	35 Watt	55 Watt

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