Xeon E-2314 vs Celeron 887

Primary details

Comparing Celeron 887 and Xeon E-2314 processor market type (desktop or notebook), architecture, sales start time and price.

Place in the ranking	not rated	1195
Place by popularity	not in top-100	not in top-100
Market segment	Laptop	Server
Series	Intel Celeron	no data
Power efficiency	no data	7.46
Architecture codename	Sandy Bridge (2011−2013)	Rocket Lake-E (2021)
Release date	1 September 2012 (12 years ago)	8 September 2021 (3 years ago)
Launch price (MSRP)	$86	no data

Detailed specifications

Celeron 887 and Xeon E-2314 basic parameters such as number of cores, number of threads, base frequency and turbo boost clock, lithography, cache size and multiplier lock state. These parameters indirectly say of CPU speed, though for more precise assessment you have to consider their test results.

Physical cores	2 (Dual-core)	4 (Quad-Core)
Threads	2	4
Base clock speed	1.5 GHz	2.8 GHz
Boost clock speed	1.5 GHz	4.5 GHz
Bus type	DMI 2.0	no data
Bus rate	4 × 5 GT/s	8 GT/s
Multiplier	15	no data
L1 cache	128 KB	64K (per core)
L2 cache	512 KB	512K (per core)
L3 cache	2 MB (shared)	8 MB (shared)
Chip lithography	32 nm	14 nm
Die size	131 mm2	no data
Maximum core temperature	100 °C	100 °C
Maximum case temperature (TCase)	no data	72 °C
Number of transistors	504 million	no data
64 bit support	+	+
Windows 11 compatibility	-	+
Unlocked multiplier	-	+

Compatibility

Information on Celeron 887 and Xeon E-2314 compatibility with other computer components: motherboard (look for socket type), power supply unit (look for power consumption) etc. Useful when planning a future computer configuration or upgrading an existing one. Note that power consumption of some processors can well exceed their nominal TDP, even without overclocking. Some can even double their declared thermals given that the motherboard allows to tune the CPU power parameters.

Number of CPUs in a configuration	1 (Uniprocessor)	1
Socket	FCBGA1023	FCLGA1200
Power consumption (TDP)	17 Watt	65 Watt

Technologies and extensions

Technological solutions and additional instructions supported by Celeron 887 and Xeon E-2314. You'll probably need this information if you require some particular technology.

Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2	Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2, Intel® AVX-512
AES-NI	-	+
FMA	+	-
AVX	-	+
Enhanced SpeedStep (EIST)	+	+
My WiFi	-	no data
Turbo Boost Technology	-	2.0
Hyper-Threading Technology	-	-
Idle States	+	+
Thermal Monitoring	+	+
Flex Memory Access	+	no data
Demand Based Switching	-	no data
FDI	+	no data
Fast Memory Access	+	no data

Security technologies

Celeron 887 and Xeon E-2314 technologies aimed at improving security, for example, by protecting against hacks.

TXT	-	+
EDB	+	+
Secure Key	no data	+
MPX	-	+
SGX	no data	Yes with Intel® SPS
OS Guard	no data	+
Anti-Theft	-	no data

Virtualization technologies

Virtual machine speed-up technologies supported by Celeron 887 and Xeon E-2314 are enumerated here.

VT-d	-	+
VT-x	+	+
EPT	no data	+

Memory specs

Types, maximum amount and channel quantity of RAM supported by Celeron 887 and Xeon E-2314. Depending on the motherboard, higher memory frequencies may be supported.

Supported memory types	DDR3	DDR4-3200
Maximum memory size	16 GB	128 GB
Max memory channels	2	2
Maximum memory bandwidth	21.335 GB/s	no data
ECC memory support	-	+

Graphics specifications

General parameters of integrated GPUs, if any.

Integrated graphics card	Intel® HD Graphics for 2nd Generation Intel® Processors	no data
Graphics max frequency	1 GHz	no data

Graphics interfaces

Available interfaces and connections of Celeron 887 and Xeon E-2314 integrated GPUs.

Number of displays supported	2	no data
eDP	+	no data
DisplayPort	+	-
HDMI	+	-
SDVO	+	no data
CRT	+	no data

Peripherals

Specifications and connection of peripherals supported by Celeron 887 and Xeon E-2314.

PCIe version	2.0	4.0
PCI Express lanes	16	44

Synthetic benchmark performance

Various benchmark results of the processors in comparison. Overall score is measured in points in 0-100 range, higher is better.

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Pros & cons summary

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Recency	1 September 2012	8 September 2021
Physical cores	2	4
Threads	2	4
Chip lithography	32 nm	14 nm
Power consumption (TDP)	17 Watt	65 Watt

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